X-ray Thickness Measurement Technology Empowers PI Film Production with Non-Contact, High-Precision Inline Thickness Control

Polyimide (PI) film is widely used in critical fields such as flexible circuit boards, chip packaging, displays, and power batteries, owing to its excellent high/low-temperature resistance, high insulation, and high mechanical strength. Thickness accuracy directly determines the insulation performance and reliability of the finished product. Micron-level thickness variations can degrade device performance and lead to product scrapping. Traditional offline sampling inspection has lag issues, making it difficult to capture local thickness fluctuations on high-speed production lines in real time. Contact measurement can easily cause compression damage and scratches to ultra-thin PI films, restricting yield improvements for high-end electronic-grade PI films.